STMicroelectronics AN2385 Application Note

This technical article explains important parameters of modern power MOSFET devices, including power dissipation and its linear derating factor, silicon limited drain current, and pulsed drain current. It explains what these parameters are and how they can be calculated, serving as a useful tool for customers to understand and facilitate reading of a power MOSFET datasheet.


STMicroelectronics AN2385 Application Note - cover page
Brand
STMicroelectronics
Category
Other Electronics
Document type
Application Note
Language
English
Pages
14
File format
PDF
File size
620 KB
Published
06 August, 2012
Updated
29 September, 2023
MD5 checksum
82710C2BE216F7283771E17716CB81FD

About this manual

This document serves as a technical guide for understanding Safe Operating Area (SOA) limits in power MOSFETs. It details the Forward Biased Safe Operating Area (FBSOA) and Reverse Biased Safe Operating Area (RBSOA), explaining how parameters like maximum drain current and breakdown voltage define these safety zones.

What's inside

  • Determination of the SOA limits
  • Silicon limited drain current
  • Determination of the power dissipation and its derating factor
  • Pulsed drain current (IDM)
  • Revision history

Frequently asked questions

What is the maximum junction temperature for automotive devices?

The maximum junction temperature is typically 150°C or 175°C for automotive devices.

At what case temperature does the device limited current equal the silicon limited current?

The device limited current equals the silicon limited current when the case temperature overcomes 110°C.

What is the junction to case thermal resistance used in the example calculation?

The example calculation uses a junction to case thermal resistance of 0.5°C/W.

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