This application note describes the solderability tests performed on STMicroelectronics lead-free devices, and how to form a reliable solder joint with the base material of the circuit board, using lead-free (Sn-Ag-Cu) or leaded (Sn-Pb) solder.
C1A25C8D9CBFBF776B1F5D958CD7F242
View all STMicroelectronics manuals →
