STMicroelectronics AN2034 Application Note Soldering Compatibility

The document discusses the semiconductor industry's transition towards lead-free packaging in accordance with new international regulations. It highlights the collaborative efforts of STMicroelectronics, Infineon Technologies, Philips Semiconductors, and Freescale (E4 group) to provide consistent and compatible solutions. The document provides detailed information on ST's lead-free finishing solutions for lead-frame based packages and ball grid array packages.

Brand: STMicroelectronics
Document type: Application Note
Language: English
Pages: 9
File format: PDF
File size: 434 KB
Published: 06 August, 2012
Updated: 28 September, 2023
MD5 checksum: 36CE27676CCFEE3CF1BC4E55D069B48D
PDF: STMicroelectronics AN2034 Application Note Soldering Compatibility PDF

About this manual

The document addresses the industry transition from leaded to lead-free soldering processes, focusing on the compatibility of semiconductor packages. It details how different package types, specifically lead-frame and Ball Grid Array (BGA), interact with both traditional Tin-Lead (SnPb) and modern Lead-free (SnAgCu) solders.

What's inside

Soldering Compatibility
Lead-Free Components
Lead-Frame Package Compatibility
BGA Package Compatibility
Reflow Soldering Profiles
Solder Joint Reliability

Frequently asked questions

What is the minimum peak temperature required for lead-free convection reflow soldering?

The minimum peak temperature for lead-free solders is 235°C.

What is the recommended peak temperature and time for lead-free convection reflow soldering?

The recommended profile is a peak temperature of 245°C for 30 seconds.

What soldering temperature is required for lead-free BGA packages to ensure processability?

The soldering temperature must be above 230°C for lead-free BGA packages.

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