BYG20 is a silicon mesa SMD rectifier produced by Vishay Telefunken. It features glass passivated junction, low reverse current, soft recovery characteristics, fast reverse recovery time, good switching characteristics and can be wave and reflow soldered. It is mainly used in surface mounting, fast rectifier, freewheeling diodes in SMPS and converters and snubber diodes.
The document provides technical specifications for the BYG20 series of Fast Silicon Mesa SMD Rectifiers manufactured by Vishay Telefunken. Key features highlighted include glass passivated junctions, low reverse current, and soft recovery characteristics suitable for high-speed switching applications.
The datasheet covers absolute maximum ratings such as reverse voltage (ranging from 200V to 600V depending on the suffix), peak forward surge current, and thermal resistance values. It also includes detailed electrical characteristic tables with typical values for forward voltage and reverse recovery time at various junction temperatures.
| Reverse Voltage (BYG20D) | 200 V |
|---|---|
| Reverse Voltage (BYG20G) | 400 V |
| Peak Forward Surge Current | 30 A |
| Average Forward Current | 1.5 A |
| Junction and Storage Temperature Range | -55...+150 °C |
| Reverse Recovery Time (Typical) | 75 ns |
The device features a glass passivated junction, low reverse current, and soft recovery characteristics.
It is designed for surface mounting and use as fast rectifiers or freewheeling diodes in SMPS and converters.
The maximum thermal resistance (junction to lead) with constant temperature is 25 K/W.