Everlight EHP-A07/SUG01-P01 High Power LED Datasheet

This document is about EHP-A07/SUG01-P01 technical data sheet. It is high power LED with small package, high efficiency, 120° viewing angle, 45lm@350mA luminous flux output, ESD protection, SMT soldering, total luminous flux, dominant wavelength parameters. It is used in TFT LCD display backlight, decorative and entertainment lighting, signal and symbol luminaries for orientation marker lights, etc.


Everlight EHP-A07/SUG01-P01 High Power LED Datasheet - cover page
Brand
Everlight
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
10
File format
PDF
File size
276 KB
Published
05 June, 2012
Updated
30 September, 2023
MD5 checksum
1FCCF97F21D305EFB3FCB6FAC5EB1FAF

About this manual

The Everlight EHP-A07/SUG01-P01 is a 1 W high‑power LED with a 120° viewing angle, >45 lm luminous flux at 350 mA, and 34 lm/W optical efficiency. It is suited for backlighting, decorative illumination, automotive lighting, and signage.

The datasheet provides detailed electrical and optical characteristics, mechanical dimensions, recommended soldering conditions, reliability test results, and precautions for storage and thermal management to ensure reliable operation in demanding applications.

What's inside

  • Features
  • Applications
  • Materials
  • Dimensions
  • Maximum Ratings
  • Electro‑Optical Characteristics
  • Typical Characteristic Curves
  • Spatial Radiation Pattern
  • Label Explanation
  • Reliability Test

Specifications

Viewing Angle120°
Luminous Flux (typical)>45 lm @350 mA
Optical Efficiency34 lm/W
Thermal Resistance (junction‑to‑lead)17 K/W
Operating Temperature Range-40 °C ~ +100 °C
Forward Current (max)500 mA
Power Dissipation (max)2.0 W
Junction Temperature (max)125 °C
Forward Voltage (typ.)3.55 V – 3.85 V
Wavelength Range525 nm – 535 nm

Frequently asked questions

What is the maximum number of reflow cycles allowed?

Reflow soldering should not be performed more than two times.

What thermal management is recommended for this LED?

Use a heat sink or high‑thermal‑conductivity substrate (Aluminum or Copper), with a minimum outer heat‑sink size of 25 mm × 25 mm × 1 mm, and consider thermal vias or conductive adhesive.

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