Agilent HSMP-386x Surface Mount PIN Diodes Data Sheet

Agilent HSMP-386x Surface Mount PIN Diodes Data Sheet


Agilent HSMP-386x Surface Mount PIN Diodes Data Sheet - cover page
Brand
Agilent
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
9
File format
PDF
File size
134 KB
Published
08 May, 2012
Updated
30 September, 2023
MD5 checksum
48248645831917A470BA135F0AAFB1C3

About this manual

The HSMP-386x series are general‑purpose surface‑mount PIN diodes offered in SOT‑23, SOT‑323 and SOT‑363 packages. They are suited for low‑capacitance switching and low‑current attenuating applications, with unique configurations that save board space and improve thermal performance.

The document provides detailed electrical specifications, absolute maximum ratings, typical performance graphs, package dimensions, marking codes, ordering options, and recommended PCB pad layouts and reflow profiles for reliable assembly.

What's inside

  • Description/Applications
  • Features
  • Electrical Specifications
  • Package Lead Code Identification
  • Typical Parameters
  • Typical Applications
  • Ordering Information
  • Assembly Information
  • Package Dimensions
  • Device Orientation

Specifications

Forward Current (I_F) (1 µs pulse)1 A
Peak Inverse Voltage (PIV)50 V
Junction Temperature (Tj)150 °C
Storage Temperature (Tstg)-65 °C to 150 °C
Thermal Resistance (Gc)500 °C/W (SOT‑23) / 150 °C/W (SOT‑323)
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