This document describes a flip-chip resistor called CHFP6KE, which has bidirectional and unidirectional characteristics. It is a glass-encapsulated resistor that eliminates wire bonding and has a maximum peak pulse power of 600 watts and a maximum continuous power dissipation of 2.5 watts. The product features non-inductive insertion and no voltage overshoot.
The CHFP6KE5.0‑CHFP6KE170CA series are flip‑chip transient voltage suppressor (TVS) diodes offered by Microsemi. They are available in both unidirectional and bidirectional versions, feature a fully glass‑passivated construction, non‑inductive insertion, and a peak pulse power of 600 W (10 µs/1000 µs). Mechanical data include a weight of about 0.01 g and solderable standoff tabs sized .040 × .040 × .010 in.
Maximum ratings include a junction temperature of 150 °C (with conformal coating), storage range –55 °C to +150 °C, continuous power dissipation of 2.5 W at a 75 °C heat sink, and various reverse standoff voltages per part number. The document also provides attachment and conformal‑coating instructions, recommended solder temperatures, and detailed electrical characteristics for each device in the series.
| Maximum Junction Temperature | 150 °C (with conformal coating) |
|---|---|
| Storage Temperature Range | -55 °C to +150 °C |
| Continuous Power Dissipation | 2.5 W @ 75 °C |
| Weight per Device | 0.01 g (approx.) |
Maximum recommended solder temperatures are 212 °C for IR reflow and 221 °C for vapor‑phase reflow.
Each device weighs approximately 0.01 gram.