National Semiconductor LMV1089 Dual Input Microphone Amplifier Datasheet

The LMV1089 is a dual input, Clarisound Far Field Noise Suppression Microphone Amplifier with Automatic Calibration Capability


National Semiconductor LMV1089 Dual Input Microphone Amplifier Datasheet - cover page
Brand
National Semiconductor
Category
audio amplifier
Document type
Datasheet
Language
English
Pages
30
File format
PDF
File size
1.4 MB
Published
04 May, 2012
Updated
30 September, 2023
MD5 checksum
939583ADB6EEF4952145929740F6B109

About this manual

The LMV1089 is a fully analog dual differential input, differential output microphone array amplifier designed to reduce background acoustic noise while preserving near‑field voice signals. It offers up to 20 dB far‑field noise rejection and consumes only 1.1 mA typical supply current, making it more efficient than many DSP solutions.

Key features include automatic calibration stored in on‑chip EEPROM, adjustable gain of 6‑36 dB, differential outputs for excellent noise immunity, and a space‑saving 36‑bump micro‑SMD package. Typical applications are headsets, two‑way radios, Bluetooth headsets, and equalized stereo microphone preamplifiers.

What's inside

  • General Description
  • Key Specifications
  • Features
  • Applications
  • Connection Diagrams
  • Pin Name and Function
  • Absolute Maximum Ratings
  • Electrical Characteristics
  • Digital Interface Characteristics
  • Notes

Specifications

Supply current (typical)1.1 mA
Signal‑to‑Noise Ratio (A‑weighted, typ)65 dB
Gain range6 dB – 36 dB
Input impedance (typ)155 Ω
Output impedance (typ)300 Ω

Frequently asked questions

What is the typical supply current of the LMV1089?

The typical supply current is 1.1 mA.

How much far‑field noise suppression can the LMV1089 provide?

It can reject far‑field acoustic noise by up to 20 dB when properly calibrated.

What is the gain adjustment range of the LMV1089?

The amplifier offers an adjustable gain from 6 dB to 36 dB.

What package does the LMV1089 use?

It is supplied in a 36‑bump micro SMD package.

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