This document is an introduction to the MDD 310 High Power Diode Modules produced by IXYS. The module has high rated current and voltage, and features low power loss and low forward voltage drop.
This document presents the technical specifications and maximum ratings for the IXYS MDD 310 high‑power diode modules. It lists key features such as a direct copper‑bonded Al₂O₃ ceramic base, planar passivated chips, and a 3600 V isolation voltage, and describes typical applications including DC power supplies, PWM inverters, and DC motor drives.
Detailed electrical ratings are given, including forward current, reverse voltage, and thermal characteristics. Thermal impedance curves, power‑dissipation graphs for single‑ and three‑phase rectifier bridges, and mechanical data such as dimensions, weight, and torque specifications are also included.
| Isolation voltage | 3600 V~ |
|---|---|
| Maximum forward current (IFRMS) | 480 A |
| Maximum reverse voltage (VRRM) | 800‑2200 V |
| Typical weight (including screws) | 320 g |
| Mounting torque (M5) | 2.5‑5/22‑44 Nm/lb·in. |
| Terminal connection torque (M8) | 12‑15/106‑132 Nm/lb·in. |
| Thermal resistance junction‑to‑case (RthJC) | 0.129 K/W |
The MDD 310 module has an isolation voltage of 3600 V~.
The maximum forward current (IFRMS) is 480 A per diode.
Mounting torque for an M5 screw is 2.5‑5/22‑44 Nm/lb·in., and terminal connection torque for an M8 screw is 12‑15/106‑132 Nm/lb·in.