This document provides information about heat sink products suitable for TO-220/TO-218/TO-247 packages, including model, mechanical outline, and thermal resistance.
The SW25-4G is an extruded heat sink with large radial fins, designed for TO-220, TO-218, and TO-247 semiconductor packages. It is RoHS compliant and suitable for standard soldering or reflow processes. The datasheet includes a mechanical outline drawing and thermal performance data, such as a thermal resistance of 11.40 °C/W based on a 75 °C rise in natural convection.
Additional information covers air velocity performance, heat dissipation ratings, and product details like finish (black anodized) and mounting options. Technical support can be reached via phone (603) 224‑9988 or email [email protected], and custom solutions are offered upon request.
| Part Number | SW25-4G |
|---|---|
| RoHS Compliance | Compliant |
| Thermal Resistance | 11.40 °C/W |
It is intended for use with TO-220, TO-218, and TO-247 packages.
Yes, the SW25-4G is RoHS compliant.
The thermal resistance is 11.40 °C/W.
Call (603) 224‑9988 or email [email protected] for technical help.