This document describes 12 NTC SMD thermistors with nickel barrier termination, suitable for surface mounting applications. They are widely used for temperature compensation and temperature control of printed circuits. The nickel barrier metallization provides excellent solderability and enables the chip to meet the requirements of the most severe soldering processes.
This document provides specifications, dimensions, packaging, and ordering information for AVX 12NTC SMD thermistors with nickel‑barrier termination (NB 12‑NB 20). It includes details on IEC sizes, operating temperature range, tolerance, power dissipation, and thermal characteristics.
Additional sections cover automatic insertion packaging, storage and solderability guidelines, surface‑mounting recommendations, and recommended soldering profiles for both leaded and lead‑free processes.
| IEC size | 0805 (NB 12), 1206 (NB 20) |
|---|---|
| Operating temperature | -55°C to +150°C |
| Tolerance on Rn (25°C) | ±5%, ±10%, ±20% |
| Maximum dissipation at 25°C | 0.12 W (0805), 0.24 W (1206) |
| Thermal time constant | 5 s (0805), 7 s (1206) |
They are used for LCD compensation, battery packs, mobile phones, CD players, heating and air‑conditioning systems, SMPS temperature control, pressure sensor compensation, and power transistor protection.