This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC866/859 family. The MPC866P is the superset device of the MPC866/859 family. This document describes pertinent electrical and physical characteristics of the MPC8245. For functional characteristics of the processor, refer to the MPC866 PowerQUICC Family Users Manual (MPC866UM/D).
The MPC866/MPC859 family are single‑chip PowerPC‑based microprocessors with integrated peripherals for controller, communications and networking applications. The document provides electrical, mechanical and timing specifications, as well as recommended layout practices.
Key sections cover features, maximum tolerated ratings, power supply sequencing, bus signal timing, JTAG (IEEE 1149.1) specifications and mechanical data for the 357‑pin PBGA package.
| Supply voltage VDDH | 0.3 to 4.0 V |
|---|---|
| Supply voltage VDDL | 0.3 to 2.0 V |
| Supply voltage VDDSYN | 0.3 to 2.0 V |
| Input voltage (Vin‑GND) | 0.3 to VDDH V |
| Storage temperature range | -55 °C to +150 °C |
| Operating temperature (extended) | -40 °C to 100 °C |
| Core voltage | 1.8 V |
| I/O voltage | 3.3 V (5‑V TTL compatible pins listed) |
| Package | 357‑pin plastic ball grid array (PBGA) |
| Maximum operating frequency | 133 MHz |
VDDH can be supplied from 0.3 V up to 4.0 V.
The device can be stored from –55 °C to +150 °C.
The core operates at 1.8 V.
It uses a 357‑pin plastic ball grid array (PBGA) package.