Analog Devices ADG3245 Datasheet

The ADG3245 is a 2.5 V or 3.3 V, 8-bit, 2-port digital switch designed by Analog Devices. It is manufactured using Analog Devices' low voltage CMOS process, which provides low power dissipation yet gives high switching speed and very low on resistance, allowing inputs to be connected to outputs without affecting signal integrity.


Analog Devices ADG3245 Datasheet - cover page
Brand
Analog Devices
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
12
File format
PDF
File size
229 KB
Published
26 March, 2012
Updated
30 September, 2023
Model
ADG3245
MD5 checksum
FC96C0929A49D33CDA00F4D811853493

About this manual

The ADG3245 is an 8‑bit, dual‑port digital switch that provides level translation between 2.5 V, 3.3 V and 1.8 V supplies. It is built on Analog Devices’ low‑voltage CMOS process, offering low power dissipation, fast switching speed, and very low on‑resistance, which minimizes propagation delay and ground‑bounce noise.

Typical applications include voltage translation for DSP or microcontroller interfaces, bus switching, bus isolation, hot‑swap and hot‑plug scenarios. The device is available in 20‑lead TSSOP and LFCSP packages and supports a maximum data rate of 1.244 Gbps.

What's inside

  • Features
  • Applications
  • General Description
  • Electrical Characteristics
  • Absolute Maximum Ratings
  • Ordering Guide
  • Pin Description
  • Typical Performance Characteristics
  • Timing Measurement Information
  • Outline Dimensions

Specifications

Propagation Delay225 ps
Maximum Data Rate1.244 Gbps
Small‑Signal Bandwidth610 MHz
Supply Voltage Operation2.5 V / 3.3 V
DC Output Current per Channel25 mA
Package Options20‑lead TSSOP and LFCSP

Frequently asked questions

What is the maximum data rate of the ADG3245?

The ADG3245 supports a maximum data rate of 1.244 Gbps.

Which supply voltages can be used with the ADG3245?

The device operates from either a 2.5 V or a 3.3 V supply.

What package styles are available for the ADG3245?

It is offered in 20‑lead TSSOP and 20‑lead LFCSP (chip‑scale) packages.

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