Maxim DS1855 Dual Nonvolatile Digital Potentiometer Datasheet

The document describes the features and characteristics of the DS1855 series products, including different models of linear potentiometers, EEPROM memory, 2-wire interface, etc.


Maxim DS1855 Dual Nonvolatile Digital Potentiometer Datasheet - cover page
Brand
Maxim
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
20
File format
PDF
File size
265 KB
Published
21 March, 2012
Updated
28 September, 2023
MD5 checksum
134695A509319B16872A19D07353C3DE

About this manual

The DS1855 is a dual nonvolatile digital potentiometer that includes two linear‑taper potentiometers (one 100‑position and one 256‑position) and 256 bytes of EEPROM memory. It is accessed via a standard 2‑wire (I²C‑compatible) serial interface and supports both hardware and software write‑protect features.

Three package options are offered (14‑pin TSSOP, 16‑ball CSBGA, and 14‑pin flip‑chip) and the device operates from 2.7 V to 5.5 V with an industrial temperature range of –40 °C to +85 °C. Up to eight devices can share a single 2‑wire bus using address pins AO‑A2.

What's inside

  • Features
  • Description
  • Pin Descriptions
  • Block Diagram
  • Memory Organization
  • 2‑Wire Operation
  • 2‑Wire Serial Port Operation
  • Ordering Information
  • Typical Operating Characteristics

Specifications

Supply voltage range2.7 V to 5.5 V
Operating temperature-40 °C to +85 °C
Package options14‑Pin TSSOP, 16‑Ball CSBGA, 14‑Pin Flip Chip
Potentiometer positionsPot0: 100 positions, Pot1: 256 positions
EEPROM memory size256 bytes
Maximum devices on bus8

Frequently asked questions

How many DS1855 devices can be connected to the same 2‑wire bus?

Up to eight DS1855 devices can share a single 2‑wire bus using unique address pins.

What voltage levels are required for the SDA and SCL pins?

Both SDA and SCL are open‑drain lines that are normally pulled high with an external resistor.

What are the available package types for the DS1855?

The DS1855 is offered in 14‑pin TSSOP, 16‑ball CSBGA (4 mm × 4 mm), and 14‑pin flip‑chip packages.

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