This document describes the features and characteristics of Kingston's KHX1600C9D3K8/32GX product. The product is a kit of eight 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM 2Rx8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 32GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V.
This document provides the specifications for Kingston's KHX1600C9D3K8/32GX memory module kit, which consists of eight 4 GB DDR3‑1600 CL9 DIMM modules for a total capacity of 32 GB. It outlines the module’s electrical characteristics, supported standards, and physical dimensions.
Key features include JEDEC‑standard 1.5 V operation, programmable latency settings, on‑die termination, and a range of temperature and power specifications. The sheet also notes compatibility notes and a disclaimer regarding over‑clocking.
| Total Kit Capacity | 32 GB |
|---|---|
| Memory Type | DDR3‑1600 CL9 240‑Pin DIMM |
| Voltage (JEDEC standard) | 1.5 V (1.425 V ~ 1.575 V) |
| Operating Power per Module | 1.410 W |
| Operating Temperature | 0 °C to 85 °C |
| Row Cycle Time (tRCmin) | 49.5 ns (min.) |
| Refresh to Active/Refresh | 160 ns (min.) |
| CL(IDD) | 9 cycles |
The kit provides a total capacity of 32 GB.
It operates at the JEDEC standard 1.5 V (range 1.425 V ~ 1.575 V).
The modules run at DDR3‑1600 with CL9‑9‑9 timing at 1.65 V, and JEDEC standard CL9‑9‑9 at 1.5 V.
They operate from 0 °C up to 85 °C.