This document provides power dissipation data for SSOT-24, including the relationship between power dissipation and ambient temperature.
This document provides power‑dissipation reference data for the SSOT‑24 device when mounted on a printed‑circuit board. The measurement conditions are: board size 40 × 40 mm, copper traces covering 50 % of the area, FR‑4 material, 1.6 mm thickness, four 0.8 mm through‑holes, natural convection cooling, and lead‑free soldering.
The data shows how power dissipation varies with ambient temperature, including a thermal‑resistance curve and a table of power values at temperatures from 25 °C up to 125 °C. The maximum junction temperature is specified as 125 °C. This manual is written in Chinese.
| Maximum junction temperature (Tj max) | 125 °C |
|---|---|
| Board dimensions | 40 × 40 mm |
| Copper trace coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Number of through‑holes | 4 × 0.8 mm diameter |
The maximum junction temperature is specified as 125 °C.