This document describes the power dissipation characteristics of the CL-2025 model, including measurement conditions, the relationship between ambient temperature and power dissipation, etc.
This document presents reference power‑dissipation values for the Torex CL‑2025 semiconductor when mounted on a standard FR‑4 board. The data are intended for design engineers to estimate thermal performance under defined conditions.
Measurements were taken on a 40 × 40 mm board with 50 % copper coverage, natural convection cooling, lead‑free soldering, 1.6 mm thickness, and 4 × 0.8 mm through‑holes. Power dissipation is plotted versus ambient temperature up to the maximum junction temperature of 125 °C.
| Board dimensions | 40 x 40 mm |
|---|---|
| Copper trace coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Through‑hole size | 4 x 0.8 mm |
| Maximum junction temperature (Tj max) | 125 °C |
The CL‑2025 is rated for a maximum junction temperature of 125 °C.