Technical specifications for Samtec MW series connectors, including materials, dimensions, plating, and temperature range.
The Samtec MW series connector specification provides detailed mechanical and electrical data for the MW family of board‑to‑board and board‑to‑cable connectors. It lists insulator and terminal materials, plating options, stacker and post heights, alignment pin and pick‑and‑place pad requirements, as well as processing guidelines such as lead‑free solderability and coplanarity.
Key dimensions include stacker heights from 0.095" to 0.245" (2.41 mm to 6.22 mm) and post heights as low as 0.065" (1.65 mm). The connectors operate over a temperature range of –55 °C to +125 °C and are available with gold over nickel plating. Additional options such as tape‑and‑reel packaging and mechanical board spacers are noted for enhanced stability.
| Insulator Material | Top: Black LCP, Bottom: Natural LCP |
|---|---|
| Terminal Material | Phosphor Bronze |
| Plating | Gold over 50 µ" (1.27 µm) Ni |
| Operating Temperature Range | -55 °C to +125 °C |
| Lead‑Free Solderable | Yes |
| SMT Lead Coplanarity | 0.10 mm (.004") max for pins 02‑30, 0.15 mm (.006") max for pins 31‑50 |
| Stacker Height | 0.095" to 0.245" (2.41 mm to 6.22 mm) |
| Post Height | Minimum 0.065" (1.65 mm) |
| Alignment Pin Positions | Minimum 5 positions |
| Pick & Place Pad Positions | Minimum 7 positions |
The connectors operate from –55 °C up to +125 °C.
Yes, they are specified as lead‑free solderable.
The contacts are plated with gold over a 50 µ" (1.27 µm) nickel layer.
Stacker heights range from 0.095" to 0.245" (2.41 mm to 6.22 mm).