EMIF06-AUD01F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. It is used in ESD sensitive equipment such as mobile phones and communication systems, wireless modules.
The EMIF06-AUD01F2 is a highly integrated device designed to suppress EMI/RFI noise and provide ESD protection for audio bottom connector interfaces. It features a flip-chip package with 20 bumps, resulting in a very thin profile of 0.65 mm and low PCB space consumption of 4.6 mm.
The device includes ESD protection circuitry compliant with IEC 61000-4-2 standards, handling up to 15 kV for external pins and 2 kV for internal pins. It is specifically intended for applications such as mobile phones and communication systems where EMI filtering in ESD-sensitive equipment is required.
| Package type | Flip chip package, 20 bumps |
|---|---|
| Package thickness | 0.65 mm |
| PCB space consumption | 4.6 mm |
| ESD protection (external pins) | 15 kV (air), 8 kV (contact) |
| ESD protection (internal pins) | 2 kV (air), 2 kV (contact) |
| Operating temperature range | -40 to +85 °C |
| Storage temperature range | -40 to +125 °C |
| Input capacitance per line | 1.3 nF typical |
The device supports IEC 61000-4-2 level 4 for external pins, with a maximum air discharge of 15 kV.
The device operates from -40 °C to +85 °C and can be stored from -40 °C to +125 °C.