EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering. The EMIF02-MIC06F3 Flip-Chip packaging means the package size is equal to the die size. That's why EMIF02-MIC06F3 is a very small device. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV.
The EMIF02-MICO6F3 is a highly integrated device featuring a 2-line symmetrical low-pass filter and an ESD protection circuit. It is specifically designed to suppress EMI/RFI noise for dual microphone line filtering in applications such as mobile phones.
The component utilizes a lead-free Flip-Chip package, resulting in very small dimensions (0.65 mm thickness) and minimal PCB space consumption (< 1.5 mm). The device offers high reliability through monolithic integration and provides ESD suppression compliant with IEC 61000-4-2 level 4 standards.
| Filter Type | 2-line symmetrical low-pass filter |
|---|---|
| ESD Protection Standard | IEC 61000-4-2 level 4 |
| Air Discharge Rating | 15 kV |
| Contact Discharge Rating | 8 kV |
| Package Type | Lead-free Flip-Chip package |
| Operating Temperature Range | -40 to +85 °C |
| Maximum Junction Temperature | 125 °C |
It is designed for mobile phones to provide differential microphone filtering and ESD protection.
The Flip-Chip packaging means the package size is equal to the die size, making it a very small device.
The EC! pin must be left open and not connected to any circuit.