This document is the datasheet of EMIF06-1002F2, a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06-1002F2 Flip Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.
The document describes the EMIF06-1002F2, a highly integrated Flip Chip package designed to suppress electromagnetic interference (EMI) and radio frequency interference (RFI). It features six EMI filters and an on-chip ESD protection circuit capable of withstanding up to 15 kV air discharge according to IEC 61000-4-2 Level 4 standards. The device is intended for use in ESD-sensitive applications such as mobile phones.
| ESD discharge (Air) | 15 kV |
|---|---|
| ESD discharge (Contact) | 8 kV |
| Junction temperature range | -30 to 125 °C |
| Storage temperature range | -55 to 150 °C |
| Breakdown voltage (VBR) | 6 V |
| Leakage current @ VRM | 200 nA |
| Series resistance (RI/O) | 80 to 120 Ω |
| Input capacitance per line | 9.2 to 13.8 pF |
| Cut-off frequency (FC) | 280 MHz |
The device complies with IEC 61000-4-2 Level 4, supporting up to 15 kV air discharge and 8 kV contact discharge on external pins.
The device includes six EMI filters.
It uses a Flip Chip package with dimensions of 1.92 mm x 1.79 mm and a thickness of 0.65 mm.