This report summarizes the reliability data for Motorola communication microprocessors fabricated on the 0.42m single polysilicon process in our wafer fabrication facility, Mos 11, in Austin, Texas.
This document summarizes reliability data for Motorola communication microprocessors, specifically the XPC850 (Rev 0.3), XPC860, and XPC860T models. These devices are fabricated using the 0.42 single polysilicon process at the Mos 11 facility in Austin, Texas. The report covers devices currently in their XC (engineering change) phase of product life, noting that design errata may exist but reliability qualifications are complete.
| Process | 0.42 single polysilicon process |
|---|---|
| Package Type (XPC850) | 256 leaded plastic ball grid array |
| Package Type (XPC860) | 357 lead plastic ball grid array |
| Moisture Sensitivity | Level 3 |
| Assembly Site | Kuala Lumpur, Malaysia |
The devices are fabricated on the 0.42 single polysilicon process.
Yes, all devices in the report have been in production manufacturing for at least 3 years.
Volume production is manufactured in Motorola's Kuala Lumpur, Malaysia facility.