ON Semiconductor NUP4301MR6T1 Low Capacitance Diode Array Datasheet

NUP4301MR6T1 is a low capacitance diode array for ESD protection in four data lines. It is designed to protect sensitive components from possible harmful electrical transients, for example, ESD (electrostatic discharge).


ON Semiconductor NUP4301MR6T1 Low Capacitance Diode Array Datasheet - cover page
Brand
ON Semiconductor
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
4
File format
PDF
File size
46 KB
Published
12 July, 2012
Updated
30 September, 2023
MD5 checksum
28F577ED083943DFAE28FC91F24D7718

About this manual

The NUP4301MR6T1 is a MicroIntegration™ device designed to protect sensitive components from electrical transients, specifically electrostatic discharge (ESD). It features low capacitance (maximum 1.5 pF between I/O lines) to ensure data line speed and integrity while providing protection for USB, HDSL, IDSL, and video lines.

The device is available in a TSOP-6 package and offers protection for JEDEC Standards JESD22 and IEC61000-4-2 (Level 4). Key specifications include a reverse voltage rating of 70 V and a peak forward surge current of 500 mA.

What's inside

  • Features
  • Applications
  • Maximum Ratings
  • Thermal Characteristics
  • Electrical Characteristics
  • Package Dimensions

Specifications

Capacitance between I/O pins1.5 pF maximum
Package TypeTSOP-6

Frequently asked questions

What is the maximum capacitance between I/O lines?

The maximum capacitance between I/O lines is 1.5 pF.

What is the maximum capacitance between I/O lines for this diode array?

The maximum capacitance between I/O lines is 1.5 pF.

What is the maximum lead solder temperature allowed for this package?

The maximum lead solder temperature is 260 °C.

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