This document contains information on a product under development at Advanced Micro Devices. The product is a Stacked Multi-Chip Package (MCP) Flash Memory and SRAM. It features a 16 Megabit flash memory and a 4 Mbit static RAM. The MCP has a power supply voltage of 2.7 to 3.3 volts and a maximum access time of 85 ns. It is packaged in a 69-Ball FBGA and operates at temperatures ranging from -25°C to +85°C. The flash memory has simultaneous read/write operations, a secured silicon sector, and zero power operation.
The document details the Am29DL163D, a Stacked Multi-Chip Package (MCP) Flash Memory and Static RAM device manufactured by AMD. It features a 16 Megabit flash memory section organized as 1,048,576 words of 16 bits each or 2,097,152 bytes of 8 bits each, alongside a 4 Mbit SRAM section.
Key characteristics include an access time of 85ns and operation with a single 3.0 volt power supply. The device supports simultaneous read/write operations by dividing memory into two banks, allowing zero latency between reading one bank while programming or erasing the other.
| Access Time | 85ns maximum |
|---|---|
| Power Supply Voltage | 2.7 to 3.3 volt |
| Package Type | 69-Ball FBGA |
| Operating Temperature | -25°C to +85°C |
The device operates with a single power supply voltage ranging from 2.7 to 3.3 volt.
The device has an 85ns maximum access time.
Bank 1 contains 4 Mb of memory while Bank 2 contains 12 Mb.