This document introduces the features and characteristics of AMD DS42553 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM.
The document details the Am29DL323D, a Stacked Multi-Chip Package (MCP) Flash Memory and Static RAM (SRAM) device manufactured by AMD. It features a 0.23 micron process technology and operates on a single 3.0 volt power supply.
| Memory Capacity (Flash) | 32 Megabit |
|---|---|
| Memory Capacity (SRAM) | 4 Mbit |
| Power Supply Voltage | 3.0 Volt-only |
| Maximum Access Time | 90ns |
| Package Type | 73-Ball FBGA |
| Operating Temperature Range | -25°C to +85°C |
The device offers an access time as fast as 70 ns, with a maximum specified at 90ns.
Yes, it is designed to be programmed in-system with a standard 3.0 volt Vcc supply.
Yes, it features simultaneous read/write operations allowing data to be continuously read from one bank while executing erase/program functions in another.