This document describes the features and characteristics of AMD DS42516 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, including: the product's power supply voltage is 2.7 to 3.3 volts, the highest performance is 90 nanoseconds, the package is 73-Ball FBGA, and the operating temperature is –25°C to +85°C.
The document details the Am29DL324D, a 32 megabit Stacked Multi-Chip Package (MCP) Flash Memory and Static RAM (SRAM). The device is organized as 2,097,152 words of 16 bits each or 4,194,304 bytes of 8 bits each. It features a 73-ball FBGA package and operates on a single 3.0 volt power supply.
| SRAM Capacity | 4 Mbit (512 K x 8-Bit/ 256 K x 16-Bit) |
|---|---|
| Power Supply Voltage | 2.7 to 3.3 volt |
| Maximum Access Time | 90ns |
| Package Type | 73-Ball FBGA |
| Operating Temperature Range | -25°C to +85°C |
The device offers an access time as fast as 70 ns, with a maximum specified at 90ns.
Yes, it supports simultaneous Read/Write operations with zero latency between banks.
Yes, it is pinout and software compatible with single-power-supply flash standard.