This document introduces the operation notes of 160 Sensors, including packaging, soldering, lead forming and cleaning.
These operation notes describe the special handling requirements for infrared photodiodes, phototransistors and photo ICs, whose plastic packages are made from a pure epoxy‑resin that is weaker than typical black molding materials. Care must be taken during mounting to avoid mechanical stress, chemical exposure, and excessive heat.
The document provides practical guidance on soldering (use a rosin‑based flux and keep lead spacing equal to hole spacing), lead forming (form leads without stressing the plastic and avoid repeated bending), and cleaning (acceptable solvents include ethyl alcohol, methyl alcohol and isopropyl alcohol). It also includes a disclaimer about usage in safety‑critical equipment and export control information.
A rosin‑based flux should be used; highly acidic or alkaline fluxes may cause corrosion.
Acceptable cleaning solvents are ethyl alcohol, methyl alcohol, and isopropyl alcohol.
Leads should be formed before soldering without applying stress to the plastic body, and they should not be bent repeatedly in the same place.