This document introduces Aavid Thermalloy's low-profile surface mount heat sinks, suitable for SMT power semiconductor devices in D-PAK, D2PAK, D3PAK, and SO-10 packages. Their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through-hole solutions. The semiconductor's conventional copper drain pad is modified to extend beyond the edges of the semiconductor package, providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad, creating a thermal conduction path.
Aavid Thermalloy offers low‑profile surface‑mount heat sinks designed for SMT power semiconductor devices in D‑PAK, D2PAK, D3PAK and SO‑10 packages. The heat sinks attach by soldering directly to a modified copper drain pad, creating a thermal path without the need for attachment holes.
The document provides ordering information, thermal performance charts (air velocity, heat dissipation, thermal resistance), and recommended copper pad footprints for various package types. Contact details for North America, Europe and Asia are also included.