Update: 28 September, 2023
This document introduces Aavid Thermalloy's low-profile surface mount heat sinks, suitable for SMT power semiconductor devices in D-PAK, D2PAK, D3PAK, and SO-10 packages. Their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through-hole solutions. The semiconductor's conventional copper drain pad is modified to extend beyond the edges of the semiconductor package, providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad, creating a thermal conduction path.
File format: PDF
Size: -
MD5 Checksum: 056918C2DE402CF5B35118A03749A7E8
Publication date: 12 April, 2012
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PDF Link: AAVID THERMALLOY Surface Mount Heat Sinks For D-PAK D 2 PAK D 3 PAK SO-10 PDF