The Y-type powersink is a compact thermal solution designed for moderate power applications on printed circuit boards. It features a black finish and can be mounted vertically with convection cooling, using the ThermPath 167 thermal interface.
The datasheet lists several variants (e.g., Y‑1, Y‑4) with different hole patterns and spacing options (TO‑3, TO‑66). Electrical ratings include a thermal resistance of 8 °C/W and power dissipation options of 5 W, 10 W, and 16 W. Mechanical dimensions and mounting details are provided for each variant.
| Thermal resistance | 8 °C/W |
|---|---|
| Finish | Black |
The thermal resistance is 8 °C/W.
The datasheet lists power dissipation options of 5 W, 10 W, and 16 W.
The powersink is finished in black.