NEC EC2 Series (DIP) and EE2 Series (SMD) Handbook

This document is about the technical data of NEC/TOKIN EC2 series and EE2 series miniature signal relays


NEC EC2 Series (DIP) and EE2 Series (SMD) Handbook - cover page
Brand
NEC
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
52
File format
PDF
File size
451 KB
Published
07 April, 2012
Updated
30 September, 2023
Model
EE2
MD5 checksum
936B77F2DF258CEBD71F3C5715EC0E4F

About this manual

The handbook describes the basic characteristics, mechanical structure, and electrical specifications of NEC's EC2 and EE2 miniature signal relays. It includes data on switching power, coil parameters, contact resistance, thermal and magnetic characteristics, and high‑frequency behavior.

Extensive test data are presented, covering environmental tests (temperature, moisture, vibration, shock), as well as contact life tests under various resistive loads. Test conditions such as 125 Vac 0.5 A (test G) and 30 Vdc 1 A (test H) are detailed, along with operating and release voltage measurements.

What's inside

  • Preface
  • Structure
  • Basic Characteristics
  • Operating & Release Voltages
  • Contact Resistance
  • Thermal Characteristics
  • Magnetic Interference
  • Environmental Tests
  • Contact Life Tests

Specifications

Contact load voltage (Test G)125 Vac
Contact load current (Test G)0.5 A
Contact load voltage (Test H)30 Vdc
Contact load current (Test H)1 A

Frequently asked questions

What quality grades does NEC/TOKIN assign to its devices?

NEC/TOKIN devices are classified into three quality grades: Standard, Special, and Specific.

What applications are recommended for Standard‑grade devices?

Standard‑grade devices are recommended for computers, office equipment, communications equipment, test and measurement equipment, audio‑visual equipment, home electronic appliances, machine tools, personal electronic equipment, and industrial robots.

What protective element should be used when a relay is driven by an IC?

A diode may be connected in parallel with the relay coil to protect the IC from the counter‑electromotive force.

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