This is a product description document for Kingston's KHX2400C11D3K4/8GX memory module. It contains information such as the module's capacity, speed, and timing.
The KHX2400C11D3K4/8GX is an 8 GB (four 2 GB) DDR3‑2400 CL11 memory kit designed for desktop platforms. It complies with JEDEC standard 1.5 V (1.425 V ~ 1.575 V) and supports Intel® XMP profiles.
Key specifications include a CAS latency of 9 cycles, operating power of 0.795 W per module, operating temperature range of 0 °C to 85 °C, and a module size of 133.35 mm length with a 30 mm height heat spreader. The kit is tested for reliability and includes gold‑contact pins.
| Capacity | 8 GB (4 × 2 GB) |
|---|---|
| Type | DDR3‑2400 CL11 240‑Pin DIMM Kit |
| CAS Latency (CL) | 9 cycles |
| Operating Voltage | 1.5 V (1.425 V ~ 1.575 V) |
| Power Consumption (per module) | 0.795 W |
| Operating Temperature | 0 °C to 85 °C |
| Storage Temperature | -55 °C to +100 °C |
| Module Length | 133.35 mm |
The kit provides a total capacity of 8 GB, made up of four 2 GB modules.
It operates at a JEDEC standard 1.5 V supply, with a range of 1.425 V to 1.575 V.
The module can operate from 0 °C up to 85 °C.
Each module consumes approximately 0.795 W of power.