Industrial

DIP2450-01D3 2G / 5G WLAN diplexer is a dual band 2.4GHz and 5GHz diplexer with features of low insertion loss, high attenuation levels, high rejection of out-of-band frequencies, small footprint.

This document describes a product called EMIF02-SPK03F2, which is a 2-channel EMI filter and ESD protection device for speaker phones. It features high efficiency in EMI filtering and ESD suppression, low PCB space consumption, thin package, high reliability, and integration. The product complies with IEC 61000-4-2 level 4 standard.

The CPL-WB-02D3 is a wide-band directional coupler designed to measure RF antenna output power. This CPL has been customized for wide band operating frequencies (2G/5G WLAN) with low insertion losses in the transmit bandwidth (2400 MHz to 5850 MHz). The CPL-WB-02D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel.

This datasheet introduces the features and characteristics of STMicroelectronics DCPL-WB-02D3, including 50 Ω nominal input / output impedance, wide operating frequency range, low insertion loss, high ESD ruggedness, lead-free CSP, small footprint, and very low profile

EMIF04-EAR02M8 is a highly integrated EMI/RFI filter designed by STMicroelectronics to suppress EMI/RFI noise in mobile phone headsets.

CPL-WB-01C2 is a wide band directional coupler produced by ST. The device has a 50 ohm input/output impedance, a working frequency range of 824-2025 MHz, an insertion loss of less than 0.2 dB, a coupling coefficient of 34 dB, a DC pass loss of 25 dB, an ESD resistance level of 4, and a flip-chip package. The device is small and has a thickness of only 690 microns.

The EMIF01-TV02F3 chip is a highly integrated device designed to suppress EMI and RFI noise in all systems with a TV analog output signal subjected to electromagnetic interferences. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV. The EMIF01-TV02F3 provides high anti-aliasing filtering performances to reject frequencies above 8 MHz, with high attenuation at 27 MHz when an external inductor of 2.2 µH is connected between pins B2 and B1.

The EMIF07-LCD03F3 is a 7-line highly integrated L/C filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF07-LCD03F3's Flip-Chip packaging means the package size is equal to the die size. This LC filter includes ESD protection circuitry.

EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering. The EMIF02-MIC06F3 Flip-Chip packaging means the package size is equal to the die size. That's why EMIF02-MIC06F3 is a very small device. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV.

This datasheet describes the EMIF06-SD03F3, a highly integrated device based on IPAD technology, combining the 5 functions described under Features.

The EMIF06-MSD02N16 is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. It is packaged in micro QFN and includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges.

The CPL-WB-00C2 is a wide band directional coupler designed to measure RF antenna output power in GSM/WCDMA applications. It features 50 Ω nominal input/output impedance, a wide operating frequency range (824 MHz to 2170 MHz), low insertion loss (< 0.2 dB), a typical coupling factor of 34 dB, high directivity (typical 25 dB), high ESD robustness (IEC 61000-4-2 Level 4), and a small footprint.

This is information on a product in full production. The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. It has very low resistance and high attenuation, and includes ESD protection circuitry. It is suitable for applications such as mobile phones.

This document is the datasheet of EMIF06-1002F2, a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06-1002F2 Flip Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.