STMicroelectronics DIP2450-01D3 2G/5G WLAN Diplexer Datasheet

DIP2450-01D3 2G / 5G WLAN diplexer is a dual band 2.4GHz and 5GHz diplexer with features of low insertion loss, high attenuation levels, high rejection of out-of-band frequencies, small footprint.


STMicroelectronics DIP2450-01D3 2G/5G WLAN Diplexer Datasheet - cover page
Brand
STMicroelectronics
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
10
File format
PDF
File size
278 KB
Published
09 August, 2012
Updated
01 October, 2023
MD5 checksum
A85234E3C4E89BEE02AD2BCE6A04019E

About this manual

The DIP2450-01D3 is a dual-band diplexer designed using STMicroelectronics IPD technology on a non-conductive glass substrate. It targets applications in WLAN, Bluetooth, and mobile phones by separating the 2.4 GHz band (2400 to 2483.5 MHz) from the 5 GHz band (4900 to 5850 MHz). The device is housed in a Flip Chip package with a very low profile of less than 600 µm after reflow.

What's inside

  • Features
  • Benefits
  • Applications
  • Absolute ratings
  • Electrical characteristics
  • Measured performance
  • Application information
  • Package dimensions

Specifications

Pass band (2G)2400 to 2483.5 MHz
Pass band (5G)4900 to 5850 MHz
Nominal impedance50 Ω
Operating temperature range-40 to +85 ºC

Frequently asked questions

What are the applications for this diplexer?

It is suitable for WLAN, Bluetooth, and mobile phone applications.

What is the package type of the DIP2450-01D3?

The device uses a Flip Chip package with 4 bumps.

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