NXP Manuals

The OM11055 is a PCF8883 evaluation board which can be used to demonstrate and evaluate the PCF8883 capacitive proximity switch. The PCB is designed to make it easy to adjust the switch’s sensitivity. The board can be powered using a Mini USB cable or a 9V battery.

This is a footprint for SOT143R package

NXP Voltage Translators (NVT) are used in bidirectional signaling voltage level translation applications for I/O buses with incompatible logic levels. The NVT2001 and NVT2002 are single- and dual-channel voltage translators, operational from 1.0 V to 3.6 V at VCC(A) (low voltage side) and 1.8 V to 5.5 V at VCC(B) (high voltage side) without direction control for open-drain or push-pull I/O devices.

This document discusses factors that need consideration when an I2C-bus is used to communicate between two points that do not share a common logic ground potential. I2C logic signals are referenced to a ground level and it is expected that connected devices share that reference. In practice, when an I2C-bus is extended to link devices that are separated by distances exceeding about 1 meter there can be many factors that cause differences in the local ground potential of those devices and that in turn affects the noise margins of the system and can lead to device ratings being exceeded. In other cases, where an I2C-bus could provide an attractive data link there is no possibility for a shared ground reference. Examples include the need to provide safety isolation between the I2C control signals and AC mains power, telephone lines, or patient monitoring medical equipment. In other cases, such as Power over Ethernet, standards require isolation of the grounds. Solutions are provided to deal with ground differences ranging from less than 1 V up to kilovolt levels by using Opto or transformer isolators in the signal path. Key to all solutions is the availability of I2C isolation devices.

This is a Nxp pc board footprint file, which describes the SOT903-1 package pcb dimensions

This is a PDF file about the PCB footprint of SOT426 chip, including the chip's solder pads, solder paste, solder pads, etc.

SOT762-1 PC board footprint for reflow soldering of DHVQFN14 package

This document provides PC board footprint dimensions for NXP B.V. 2008. It includes solder land and solder paste dimensions for the LFBGA296 package, as well as a generic footprint pattern for reflow soldering. The document provides important information on product dimensions and soldering methods for users.

This document provides information on the dimensions and soldering details of the NXP Semiconductors PC board footprint SOT815-1. It includes the footprint information for reflow soldering of the DHVQFN24 package.

This document describes the PCB board footprint for reflow soldering of the HSOP16F package produced by NXP B.V. in 2008. The document provides the dimensions and solder pad layout of the package.

This is a PDF file containing the package dimension information of SOT630-2, including P, SL, SP, SR, etc.

This document provides information about the dimensions of the NXP B.V. PC board footprint SOT841-4 package, as well as the solder land information for reflow soldering.

This document provides information about the PC board footprint dimensions of the NXP SOT1085-1 package. It describes the dimensions of the solder land and solder paste deposit, as well as the generic footprint pattern for reflow soldering.

This document provides the PCB footprint information for SOT962-3, including dimensions, solder pads position etc.

This document is about the PC board footprint for reflow soldering of NXP Semiconductors XQFN8 package. The document provides dimensions and layout of the footprint, as well as the clearance placement and occupied area solder lands for soldering process.