NXP manuals, page 2
NXP PSMN075-100MSE MOSFET
New standards and proprietary approaches are enabling the next generation of Powerover- Ethernet (PoE) systems capable of delivering up to 100W to each powered device (PD). Large screen LCD displays, 3G / 4G / Wi-Fi hot-spots and pan-tilt-zoom CCTV cameras, for example, are placing increased demands on the power sourcing equipment (PSE) in terms of
NXP PMV130ENEA MOSFET
N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
NXP PMPB215ENEA MOSFET
N-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
NXP PMEG2002AESF barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultra small Surface-Mounted Device (SMD) package.
NXP UM10736 LPC User
The LPC15xx are ARM Cortex-M3 based microcontrollers for embedded applications featuring a rich peripheral set with very low power consumption. The ARM Cortex-M3 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration.
NXP PMEG4020EPK barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small DFN1608D-2 (SOD1608) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
NXP PSMN6R3-120ES MOSFET
Standard level N-channel MOSFET in I2PAK package qualified to 175
NXP PMXB120EPE MOSFET
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
NXP PMXB75UPE MOSFET
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
NXP PSMN1R6-40YLC MOSFET
Logic level enhancement mode N-channel MOSFET in LFPAK package. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment.
NXP PSMN020-30MLC MOSFET
Logic level enhancement mode N-channel MOSFET in LFPAK33 package. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment
NXP TYN20-800T Thyristor
Planar passivated Silicon Controlled Rectifier (SCR) in a SOT78 (TO-220AB) plastic package intended for use in applications requiring very high inrush current capability, high thermal cycling performance and high junction temperature capability (Tj(max) = 150
NXP PSMN1R1-30EL MOSFET
Logic level N-channel MOSFET in I2PAK package qualified to 175
NXP UM10580 Mini board Application
Mini board PCU9669 is a demonstration board for I2C-bus controllers. This demo board enables quick and easy evaluation of PCU9669 and PCA9665 with mbed.
NXP PSMN7R5-30MLD MOSFET
Logic level gate drive N-channel enhancement mode MOSFET in LFPAK33 package. NextPowerS3 portfolio utilising NXP