The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.
This document provides technical reference data for the Citiled CL-L103 series LED lighting packages. It explains that due to the small surface area of the package, an external radiator such as a heat sink is required to release heat efficiently into the atmosphere.
The datasheet details the laminated structure of the package, which includes an aluminum substrate designed to conduct heat from the light-emitting diode directly to the outside. It provides specific thermal resistance values (Rj-c) and formulas for calculating junction temperature based on input power and ambient conditions.
The absolute maximum rating for the CL-L103-C3 package is 120°C.
The rated input power for the CL-L103-C6 simulation is 6.51W.
The heat sink dimensions are 64mm wide, 40mm high, and variable length.