CITIZEN CL-L251 Series LED Heat Dissipation Datasheet

The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.


CITIZEN CL-L251 Series LED Heat Dissipation Datasheet - cover page
Brand
CITILED
Category
lighting LED
Document type
Datasheet
Language
English
Pages
7
File format
PDF
File size
168 KB
Published
31 March, 2014
Updated
25 September, 2023
MD5 checksum
CC48AA14F4276C28080AA95333A67226

About this manual

This document provides technical data regarding the heat dissipation structure of the CITIZEN CL-L251 Series LED light engine. It explains the significance of managing junction temperature (Tj) and describes the package's laminated structure, which utilizes an aluminum substrate to efficiently conduct heat away from the LED die.

What's inside

  • Introduction
  • Package structure and thermal resistance
  • Thermal design outside the package
  • Simulation (CL-L251-C4)
  • Simulation (CL-L251-C6)

Specifications

Rated Input Power (CL-L251-C4)4.63W
Rated Input Power (CL-L251-C6)6.7W

Frequently asked questions

What are the dimensions of the heat sink used in the CL-L251-C6 simulation?

The simulated heat sink has a width of 64mm, a height of 40mm, and a variable length.

What is the rated input power for the CL-L251-C6 package?

The rated input power for this package is 6.7W.

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