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2026-09-29

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CITILED CLL801-0101A7-65CM1A2 Data Sheet

Datasheet 14 pages · 609 KB · EN

This data sheet describes the CLL801-0101A7-65CM1A2 LED chip, including its electrical and optical characteristics such as forward voltage, luminous flux, CRI and correlated color temperature. It also lists the chip's dimensions, maximum ratings and recommended circuit design practices.

Additional sections cover reliability testing, tape and reel packaging, moisture‑proof packing, soldering and washing procedures, eye‑safety considerations, and general precautions for product use and design.

Covers: Scope of Application · Outline Dimensions · Performance Ratings · Electro‑optical Characteristics · Reliability Tests · Taping Specifications

Latest CITILED manuals

• CITILED CLL801-0101A7-65CM1A2 Data Sheet

  Datasheet 14 pages · 609 KB · EN

  The CITILED CLL801-0101A7-65CM1A2 data sheet provides specifications, performance, reliability and handling guidelines for this LED chip.

• CITILED CLL030 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CLL040 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CLL020 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CL-L251 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CL-L233 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CL-824 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CL-L103 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CLL130 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CLL050 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CLL010 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

• CITILED CL-L270 lighting LED

  The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.

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