The light-emitting diode of an LED package radiates light and heat according to the input power. However, the surface area of an LED package is quite small,and the package itself is expected to release little heat into the atmosphere.An external radiator such as a heat sink is thus required.The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.
The document explains that due to the small surface area of the LED package, an external radiator such as a heat sink is required. The CL-L233 series utilizes a laminated aluminum substrate structure where the light-emitting diode is mounted directly on the conductive substrate to efficiently transfer generated heat to the outside.
| Absolute Maximum Junction Temperature (Tj) | 120°C |
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An external radiator such as a heat sink is required because the surface area of the LED package is quite small and it cannot release much heat into the atmosphere on its own.
The heat dissipation structure up to the connection portion of the external radiator uses mainly heat conduction.