ST EMIF06-1005M12 6-line IPAD low capacitance EMI filter ESD protection in micro QFN package handbook

EMIF06-1005M12 is a 6-line, highly integrated EMI filter with IPAD technology from ST company. It has high efficiency in EMI filtering and can effectively suppress EMI/RFI noise. It can be widely used in mobile phone LCD and camera, computers and printers, communication systems and MCU boards.


ST EMIF06-1005M12 6-line IPAD low capacitance EMI filter ESD protection in micro QFN package handbook - cover page
Brand
STMicroelectronics
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
10
File format
PDF
File size
182 KB
Published
09 August, 2012
Updated
01 October, 2023
MD5 checksum
A3DF941A9A7CC6228CD20FCAF15D5316

About this manual

The EMIF06-1005M12 is a highly integrated 6-line device designed to suppress electromagnetic interference (EMI) and radio frequency interference (RFI). It features high efficiency in EMI filtering with -34 dB attenuation from 900 MHz to 1.8 GHz and provides ESD suppression up to IEC 61000-4-2 level 4 on input pins.

The component is housed in a lead-free Micro QFN package measuring 2.5 mm x 1.5 mm with a maximum height of 0.6 mm. The document includes absolute ratings, electrical characteristics such as line capacitance and clamping voltage, ordering information, and detailed recommendations for PCB assembly including stencil design and reflow profiles.

What's inside

  • Features
  • Applications
  • Absolute Ratings
  • Electrical Characteristics
  • Package Information
  • PCB Assembly Recommendations
  • Ordering Information

Specifications

Number of lines6-line
EMI attenuation (900 MHz to 1.8 GHz)-34 dB
Package dimensions (L x W)2.5 mm x 1.5 mm
Maximum package height0.6 mm
ESD rating (Air discharge)15 kV
ESD rating (Contact discharge)8 kV
Operating temperature range-40 to +85 °C
Typical line capacitance per line45 pF

Frequently asked questions

What is the package type for the EMIF06-1005M12?

The device uses a Micro QFN package with dimensions of 2.5 mm x 1.5 mm.

Is the EMIF06-1005M12 lead-free?

Yes, it is available in a lead-free package.

What are the recommended stencil opening thickness and aspect ratio for assembly?

The recommended stencil thickness is 75 to 125 µm, with an aspect ratio greater than 1.5.

Download PDF (182 KB)

More STMicroelectronics Manuals


View all STMicroelectronics manuals →