The EMIF02-AV01F3 is a highly integrated array designed to suppress EMI / RFI noise and provide impedance matching for mobile phones and portable applications. The EMIF02-AV01F3 is in Flip-Chip package to offer space saving and high RF performance. Additionally, this low-pass filter includes an ESD protection circuitry to prevent damage to the application when subjected to ESD surges up to 15 kV.
The EMIF02-AV01F3 is a highly integrated array designed to suppress EMI/RFI noise and provide impedance matching for mobile phones and portable applications. It features a Flip-Chip package to offer space saving and high RF performance.
| ESD discharge (External pins, air) | 15 kV |
|---|---|
| ESD discharge (External pins, contact) | 8 kV |
| Maximum junction temperature | 125 °C |
| Operating temperature range | -40 to +85 °C |
| Line capacitance (Typical) | 3.2 nF |
The maximum junction temperature is 125 °C.
The total power dissipation is 200 mW.
The recommended copper pad diameter is 220 µm.