The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. It features EMI symmetrical (I/O) low-pass filter, high efficiency in EMI filtering, lead-free coated package, very low PCB space occupation, very thin package, high efficiency in ESD suppression, high reliability offered by monolithic integration, and high reduction of parasitic elements through integration and wafer level packaging.
The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise and protect against ESD surges up to 15 kV. It features a symmetrical low-pass filter design with high efficiency in both filtering and ESD suppression.
The device utilizes a Coated Flip-Chip package measuring 1.42 mm x 1.42 mm with a thickness of 0.65 mm. It complies with IEC 61000-4-2 standards for air and contact discharge and is suitable for applications such as SIM and UIM interfaces.
| Package dimensions | 1.42 mm x 1.42 mm |
|---|---|
| Package thickness | 0.65 mm |
| ESD air discharge (external pins) | 15 kV |
| ESD contact discharge (external pins) | 8 kV |
| Operating temperature range | -40 to +85 °C |
| Storage temperature range | -55 to +150 °C |
| Maximum junction temperature | 125 °C |
| Line capacitance (Cline) | 20 pF max |
The device provides protection up to 15 kV for air discharge on external pins.
Yes, it is available in a lead-free coated flip-chip package.
It is designed for SIM Interface and UIM Interface applications.