The EMIF01-TV01F3 is a highly integrated array designed to suppress EMI/RFI noise and provide impedance matching for mobile phone and portable applications. It is in a Flip Chip package to offer space saving and high RF performance.
The EMIF01-TV01F3 is a highly integrated array designed to suppress EMI/RFI noise and provide impedance matching for mobile phone and portable applications. It features an internal low-pass filter with built-in ESD protection circuitry capable of handling surges up to 15 kV (air discharge) on TV_OUT interfaces.
The device is available in a lead-free Flip Chip package with a 400 µm pitch, offering very low PCB space occupation and high RF performance. The document provides absolute maximum ratings, electrical characteristics including breakdown voltage and input capacitance, application circuit models, ordering information, and mechanical package dimensions.
| ESD discharge (air) | 15 kV |
|---|---|
| ESD discharge (contact) | 8 kV |
| Operating temperature range | -30 to +85 °C |
| Storage temperature range | -55 to 150 °C |
| Breakdown voltage (Vbr) | 6 V |
| Leakage current (@ Vary) | 0.2 pA |
| Dynamic impedance (Ry) | 75 Ω |
| Input capacitance per line (@0V) | 30 pF |
The device withstands an ESD discharge of up to 15 kV for air discharge on both internal and external pins.
The device operates within a temperature range of -30 to +85 °C.
The maximum power dissipation is 80 °C.