The EMIF02-SPK01F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. It features high efficiency EMI filtering, low PCB space consuming, high reliability, and high efficiency in ESD suppression.
The EMIF02-SPK01F2 is a highly integrated device designed to suppress EMI/RFI noise and provide ESD protection for systems subjected to electromagnetic interference. It utilizes a Flip-Chip package where the package size equals the die size, offering very low PCB space consumption and high reliability through monolithic integration. The device includes an ESD protection circuitry capable of withstanding surges up to 15 kV.
Key features include a symmetrical (I/O) low-pass filter with a line capacitance of 200 pF and a dynamic impedance of 10 Ω. The device complies with IEC 61000-4-2 standards for ESD immunity, supporting Level 4 on output pins (15 kV air discharge, 8 kV contact discharge) and Level 1 on input pins (2 kV air/contact discharge). It is intended for applications such as mobile phones, communication systems, computers, and MCU boards.
| Line capacitance | 200 pF |
|---|---|
| Dynamic impedance | 10 Ω |
| Maximum junction temperature | 125 °C |
| Operating temperature range | -40 to +85 °C |
| ESD protection (Output pins) | 15 kV air discharge, 8 kV contact discharge |
| ESD protection (Input pins) | 2 kV air discharge, 2 kV contact discharge |
| Package type | Flip-Chip |
The device is designed for mobile phones, communication systems, computers, printers, and MCU boards where EMI filtering in ESD sensitive equipment is required.
The package measures 1.07 mm x 1.47 mm with a thickness of 0.65 mm.