EMIF09-SD01F3 is a highly integrated array designed to suppress EMI/RFI noise for secure digital memory cards. It is in a Flip Chip package to offer space saving and high RF performance. This low-pass filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV. This filter also has a low line capacitance to be compatible with high data rate signals.
The EMIF09-SD01F3 is a highly integrated array designed to suppress EMI/RFI noise for secure digital memory cards in mobile phones and communication systems. It features a Flip Chip package with 24 bumps, offering space-saving dimensions of less than 4 mm² and a thickness of 0.6 mm.
The device includes built-in ESD protection circuitry capable of handling surges up to 15 kV on external pins (air discharge) and 8 kV (contact discharge). It complies with IEC 61000-4-2 standards for both external and internal pins, ensuring high reliability through monolithic integration.
| ESD discharge (external pins, air) | 15 kV |
|---|---|
| ESD discharge (external pins, contact) | 8 kV |
| ESD discharge (internal pins, air) | 2 kV |
| Operating temperature range | -30 to + 85 °C |
| Storage temperature range | -55 to 150 °C |
| Package type | Flip Chip |
The device protects against air discharge up to 15 kV and contact discharge up to 8 kV on external pins.
The device operates within a temperature range of -30 to +85 °C.