This document presents guidelines for upgrading from the ST92F120 (0.50µm) to the ST92F124/F150/F250 (0.35µm). Microcontrollers for embedded applications are integrating more peripherals and larger memories. Shrinking the microcontroller die size is necessary to provide the right products with the right features at the right cost. The purpose of this document is to highlight the differences between the ST92F120 (0.50µm) and ST92F124/F150/F250 (0.35µm) microcontrollers and provide guidelines for upgrading the application's software and hardware.
This document outlines the differences between the ST92F120 microcontroller in 0.50 micron technology and the ST92F124/F150/F250 devices in 0.35 micron technology. It focuses on hardware modifications, such as pinout changes, memory organization updates, and new peripheral features like the single-channel ADC and CAN interface.
The guide also details necessary software modifications, including register remapping for Flash and E3PROM control, changes to reset and clock control units, and updates to internal voltage regulators. It serves as a reference for engineers transitioning their designs from the older 0.50 micron architecture to the improved 0.35 micron versions.
| Technology Node (New) | 0.35 µm |
|---|---|
| Technology Node (Old) | 0.50 µm |
| ADC Resolution (New) | 10 bits |
| ADC Channels (New) | Single 16 channel |
| Core Voltage | 3.3V |
| I/O Voltage | 5V |
The new peripherals include the Controller Area Network (CAN) and the asynchronous Serial Communication Interface (SCI-A).
I/O ports with Special Schmitt Triggers were removed and replaced by I/O ports with High Hysteresis Schmitt Triggers.