This document describes the features and characteristics of SMSC GT3200 and SMSC USB3250, including USB-IF certification, support for USB2.0 specification, support for data transmission rates of 480Mbps and 12Mbps, integrated termination resistors, internal short circuit protection, low power consumption, etc.
This document is a technical datasheet for the SMSC GT3200 and USB3250 USB 2.0 Physical Layer (PHY) Integrated Circuits. The chips are available in TQFP and QFN packages and support High-Speed (480Mbps) and Full-Speed (12Mbps) serial data transmission rates compliant with the USB-IF specification.
The datasheet provides detailed information on functional block diagrams, pinouts, interface signal definitions, and electrical characteristics. It includes specific sections for system clocking, clock and data recovery circuits, transmit/receive logic, and various modes of operation such as suspend, reset, resume, and high-speed detection handshakes.
The device draws a maximum of 72mA when operating in HS mode.
It supports an ambient temperature range from -40°C to +85°C.
The on-chip oscillator operates with a low cost 12MHz crystal.