This article introduces the advantages and application areas of using Surface Mount Technology (SMT), and introduces a new high-power IC surface mount package family: PowerSO-20™ and PowerSO-36.
STMicroelectronics introduced the PowerSO family (PowerSO-20 and PowerSO-36) to address the industry demand for miniaturization and quality in power applications. These packages are designed specifically for Surface Mount Technology (SMT), overcoming limitations of existing power semiconductor packages that require manual insertion or wave soldering.
The document details the mechanical data, structure, and characteristics of these new packages, which feature a massive copper slug for high thermal performance and current capability. It compares PowerSO-20/36 with alternative surface mount solutions like the Heptawatt package and traditional Multiwatt packages, demonstrating that PowerSO is the real successor to Multiwatt for SMT applications.
| Package Family Registration | Jedec MO-166 |
|---|---|
| PowerSO-20 Lead Count | 20 leads |
| PowerSO-20 Pitch | 0.050 inch (1.27 mm) |
| PowerSO-36 Lead Count | 36 leads |
| PowerSO-36 Pitch | 0.026 inch (0.65 mm) |
| Target Failure Rate | 1 ppm for early life |
PowerSO-20 has the same junction to case thermal resistance (Rth(j-c)) as the Multiwatt package.
The packages are designed for high currents ranging between 10 and 20 Amperes.