This document outlines essential ground rules and design practices for high-resolution, high-speed data converters operating at word rates above 1 MHz. It addresses common difficulties designers face when transitioning from low-speed designs to high-frequency applications, specifically focusing on printed-circuit board (PCB) layout strategies.
The text details specific techniques for separating analog and digital signals, managing ground planes, and selecting appropriate power supply components. Key recommendations include using double-sided copper-clad boards, maximizing ground area, connecting grounds locally within the PCB while maintaining system-level separation, and utilizing ceramic and tantalum capacitors to bypass noise on power lines.
Applications engineers recommend that all bread-board designs be done on double-sided copper-clad boards.
Analog ground and digital ground should be connected together within the PC board to enhance converter performance.