Introduces the method of handling surface mount devices in automated circuit board assembly systems, including product features and characteristics
This document provides a comprehensive specification for the Tape-and-Reel shipment method of surface mount semiconductor devices. It describes the conductive PVC materials used to reduce static charge and ensures compatibility with automated pick-and-place assembly systems. The specification covers the mechanical layout, including the conductive cover tape, arbor hole, and sprocket holes required for machine feeding.
| Material (Cover Tape) | Polyester |
|---|---|
| Material (Cavity Tape) | Conductive PVC |
| Material (Reel) | Solid 80 pt. Fibreboard |
| Standard Compliance | EIA standard RS-481A |
| Quantity per Reel | Hundreds-to-thousands |
It fully meets the proposed EIA standard RS-481A for taping of surface-mounted components.
The cavity tape is made of conductive PVC material to reduce static charge buildup.
The arbor hole is for mounting the reel on a pick-and-place machine.